* socket LGA 1155 * 3M chache specifikace * # of Cores - 2 * # of Threads - 2 * Clock Speed - 2.6 GHz * Intel® Smart Cache - 3 MB * Bus/Core Ratio - 26 * DMI - 5 GT/s * Instruction Set - 64-bit * Instruction Set Extensions - SSE4.1/4.2 * Embedded Options Available - ne * Lithography - 32 nm * Max TDP - 65 W * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1066 * # of Memory Channels - 2 * Max Memory Bandwidth - 21 GB/s * Graphics Specifications - * Processor Graphics - Intel® HD Graphics * Graphics Base Frequency - 850 MHz * Graphics Max Dynamic Frequency - 1.1 GHz * Intel® Quick Sync Video - ne * Intel® InTru™ 3D Technology, - ne * Intel® Insider™ - ne * Intel® Wireless Display - ne * Intel® Flexible Display Interface (Intel® FDI) - ano * Intel® Clear Video HD Technology - ne * Dual Display Capable - ano * Expansion Options - * PCI Express Revision - 2 * Package Specifications - * Max CPU Configuration - 1 * TCASE - 69.1°C * Package Size - 37.5mm x 37.5mm * Sockets Supported - FCLGA1155 * Halogen Free Options Available - ano * Advanced Technologies - * Intel® Turbo Boost Technology - ne * Intel® Hyper-Threading Technology - ne * Intel® Virtualization Technology (VT-x) - ano * Intel® Virtualization Technology for Directed I/O (VT-d) - ne * Intel® Trusted Execution Technology - ne * AES New Instructions - ne * Intel® 64 - ano * Idle States - ano * Enhanced Intel SpeedStep® Technology - ano * Thermal Monitoring Technologies - ano * Intel® Fast Memory Access - ano * Intel® Flex Memory Access - ano * Execute Disable Bit - ano