Základné dosky

Formát:ATX; Chipset:Intel Z890; Socket (pätica):Socket 1851; Typ pamäťového modulu:DDR5; Podpora RAID:0, 1, 5, 10; PCI express 16x:2

Formát:Mini-ITX; Chipset:Intel Z890; Socket (pätica):Socket 1851; Typ pamäťového modulu:DDR5; Podpora RAID:0, 1, 5, 10; PCI express 16x:1

Supermicro main board server MBD-H12DSi-NT6-B, Dual AMD EPYC 7003/7002 Series CPUs, 10 SATA3, 2 SATADOM, 4 NVMe, Dual 10GBase-T LAN ports, 1 dedicated IPMI LAN Port, 8x 4-pin PWM Fans & Speed control Technical Specification Procesor Chipset: System on Ch

Key Features 1.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x1

Key Features 1.Single AMD EPYC™ 7002 Series Processor 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 2 M.2 5.2 Gigabit Et

Key Features 1.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x1

Key Features 1.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x1

Supermicro main board server MBD-H12DSi-NT6-B, Dual AMD EPYC 7003/7002 Series CPUs, 10 SATA3, 2 SATADOM, 4 NVMe, Dual 10GBase-T LAN ports, 1 dedicated IPMI LAN Port, 8x 4-pin PWM Fans & Speed control Technical Specification Procesor Chipset: System on Ch

Key Features 1.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x1

Supermicro mainboard server MBD-H12SSL-i-B, ATX, 8 DIMM slots, 8 SATA3, 2 M.2, 8 SATA3 or 2 NVMe via single SlimSAS x8, 2 Gigabit Ethernet LAN Ports,

Supermicro mainboard server MBD-H12SSL-NT-O, Single AMD EPYC 7002 Series CPU 2TB Registered ECC DDR4, 8 DIMMs 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 2 M.2, 2 SlimSAS x8, Dual 10GBase-T LAN via Broadcom BCM57416 Procesor Chipset: System on Chip (SoC) CPU SECC sta

Key Features AMD EPYC™ 4004 series and Ryzen™ 7000 Series Processors single socket LGA-1718 (socket AM5), up to 170W. Up to 192GB ECC/non-ECC Unbuffered DIMM, DDR5-5200MHz, in 4 DIMM slots. 2 PCIe 5.0 x16 (16/NA or 8/8), support up to 2 GPU cards(mechani

Key Features AMD EPYC™ 9004 series Processors System on Chip Up to 3TB 3DS ECC RDIMM, DDR5-4800MHz in 12 DIMM slots 3 PCIe 5.0 x16 2 PCIe 5.0 x8 Up to 6 USB 3.0 ports(4 rear + 2 via header) 8 SATA3 6 PWM 4-pin Fans with tachometer status monitoring M.2 In

Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2133MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2133MHz, in 4 DIMM slots 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 1 Mini-PCI-E, 2 PCI-E 3.0 NVMe x4 Intern

Key Features Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C621 Chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E

Key Features 1.Single AMD EPYC™ 7002 Series Processor 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.2 M.2, 2 SlimSAS x8

Key Features 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 4TB Intel® O

Key Features 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s Intel® C621A Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots 4

Key Features 10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3/Pentium®/Celeron® Processor, 11th Generation Intel® Core™ i5/i7/i9 Processors, Intel® Xeon® W-1200 Processors, Intel® Xeon® W-1300 Processors Single Socket LGA-1200 (Socket H5) suppor

10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® W-1200 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 125W TDP Intel® W480 Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-29